With the continuous development of society, today's era is an era of informationization. Semiconductors and integrated circuits have become the theme of the modern era. The technology that directly affects the mechanical properties of semiconductors and integrated circuits is the process of chip packaging. Chip packaging has always been industrial. A big problem in production, then how does the automatic dispensing machine overcome this problem, and how is it applied in the chip packaging industry? Please see the analysis of the intelligent technicians of Shenzhen Dispenser manufacturer!
How is the automatic dispenser used in the chip packaging industry?
First, chip bonding
PCB is prone to shifting during the bonding process. In order to avoid the electronic components falling off or shifting from the PCB surface, we can use the automatic dispenser equipment to dispense the surface of the PCB, and then put it into the oven to heat and cure. Electronic components can be firmly attached to the PCB.
Second, the bottom material filling aspect
I believe that many technicians have encountered such a problem. In the flip chip process, because the fixed area is smaller than the chip area, it is difficult to bond. If the chip is subjected to impact or thermal expansion, it is easy to cause bump breakage. The chip will lose its proper performance. In order to solve this problem, we can inject the organic glue into the gap between the chip and the substrate through the automatic dispenser, and then solidify, which effectively increases the connection between the chip and the substrate. The area further enhances their bonding strength and has a good protection for the bumps.
Third, the surface coating aspect
When the chip is soldered, we can apply an epoxy resin with low viscosity and good fluidity between the chip and the solder joint through the automatic dispenser, so that the chip not only improves the appearance of the chip, but also Preventing the erosion and stimulation of foreign objects, it can protect the chip well and prolong the service life of the chip!
A lenticular lens is a lenticular lens sheet that includes an incident surface and an exit surface, and is characterized in that the focal length of the middle part of the lens surface is relatively long, and the focal length of the ends of each lens surface is relatively short. The lenticular lens is mainly used to condense the light from a point light source or transmit an image to other optical systems.
Widely used in optical systems such as expander lenses, imaging lenses, convergent lenses and other optical lenses.
The biconvex lens has a positive focal length and is often used in applications such as imaging or beam collimation. The coated lens is also widely used in the visible and near-infrared fields.
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