Copper Clad Laminate (CCL), which is made of wood pulp paper or fiberglass cloth, is impregnated with resin, coated with copper foil on one or both sides, and hot pressed. A product. When it is used in the production of multi-layer boards, it is also called core board (CORE).
At present, the copper clad laminates available on the market are mainly classified into the following categories: paper substrates, fiberglass cloth substrates, synthetic fiber cloth substrates, non-woven substrates, and composite substrates.
The substrate is an insulating layer composed of a polymer synthetic resin and a reinforcing material; the surface of the substrate is covered with a pure copper foil with high conductivity and good solderability, and the thickness is usually 35 to 50/ma; the copper foil is covered on the substrate. The copper clad laminate on one side is called a single-sided copper clad laminate, and the copper clad laminate on which both sides of the substrate are covered with copper foil is called a double-sided clad copper clad plate; whether the copper foil can be firmly covered on the substrate is completed by an adhesive.
1, the substrate
An insulating laminate composed of a polymer synthetic resin and a reinforcing material can be used as a substrate for a copper clad plate. There are many types of synthetic resins, and phenolic resins, epoxy resins, polytetrafluoroethylene, and the like are commonly used. Reinforcing materials generally have two kinds of paper and cloth, which determine the mechanical properties of the substrate, such as dipping resistance, bending strength and the like.
2, copper foil
It is a key material for the manufacture of copper clad plates and must have high electrical conductivity and good weldability. The surface of the copper foil is required to have no scratches, blisters and wrinkles. The purity of the metal is not less than 99.8%, and the thickness error is not more than ±5um. According to the ministerial standards, the nominal series of copper foil thickness is 18, 25, 35, 70 and 105um. China is gradually promoting the use of 35um thick copper foil. The thinner the copper foil, the easier it is to etch and drill, making it particularly suitable for manufacturing high-density printed boards with complex lines.
3, CCL adhesive
The adhesive is an important factor in whether the copper foil can be firmly adhered to the substrate. The peel strength of the copper clad is mainly determined by the properties of the adhesive.
According to the different requirements and grades of PCB, the main substrate - CCL has many product varieties. They are classified differently according to different rules.
(1) According to the different mechanical rigidity of CCL, it can be divided into rigid CCL and flexible CCL according to the mechanical rigidity of CCL.
(2) According to different insulation materials and structure division, it is divided into organic resin type copper clad laminate, metal base (core) copper clad laminate, and ceramic base clad copper clad.
(3) According to the thickness of different insulation layers, it can be divided into conventional plates and thin plates.
(4) According to the different reinforcing materials used, this division is called a material substrate when the copper clad plate uses a certain reinforcing material. There are three types of rigid organic resin copper clad laminates commonly used for different reinforcing materials: fiberglass cloth-based copper clad laminates; paper-based copper clad laminates; and composite clad copper clad laminates. In addition, there are also copper clad laminates made of special reinforcing materials: aramid fiber non-woven base copper clad laminates, synthetic fiber based clad copper clads, and the like.
(5) The copper clad laminate is referred to as a resin-based copper clad laminate by using a certain resin in accordance with the insulating resin to be used. At present, the most common main resin is: phenolic resin, epoxy resin (EP), polyimide resin (PI), polyester resin (PET), polyphenylene ether resin (PPO or), cyanate resin (CE) , polytetrafluoroethylene resin (PTFE), bismaleimide triazine resin (BT).
Use of copper clad laminateCCL is an extremely important basic material for printed circuit boards. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and plated on a copper clad plate. Different printed circuits (single, double, multi-layer).
As a substrate material in the manufacture of printed circuit boards, copper clad laminates mainly play a role in interconnecting conduction, insulation and support, and have a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality, manufacturing processability, manufacturing level, manufacturing cost, and long-term reliability and stability of the printed circuit board largely depend on the copper clad laminate.
The basic copper clad laminate is mainly used to manufacture printed circuit boards for supporting and interconnecting and insulating each other. It is called an important basic material for printed circuit boards. It is an important electronic material that is indispensable for all electronic products, including aviation, aerospace, remote sensing, telemetry, remote control, communication, computer, industrial control, household appliances, and even high-end children's toys. With the continuous improvement of the level of technology, in recent years, some special electronic copper clad laminates have also been used to directly manufacture printed electronic components.
Due to the small size, light weight and thinness of electronic products, the printed circuit boards must be equipped with various high-quality and high-tech characteristics, so that the printed circuit board manufacturing technology directly relates to a variety of contemporary high-tech, its main and most important Materials - CCL, it must be accompanied by a variety of high quality and high technical characteristics.
Therefore, the position of CCL in the electronic information industry is becoming more and more important.
Guangdong Jianye Laminate Co., Ltd., the world's largest supplier of copper-clad laminates, again announced the price increase notice on August 21, and immediately increased its PCB board (ie, composite copper) and PP (pre-cured) prices by 10 yuan/sheet. 10%. This is the third time the company has issued a price increase notice after entering July. The first two were July 7 and 26 respectively, and the price increases were 10 yuan/sheet and 10% respectively.
Guangdong Jianye Laminates Co., Ltd. is not the only CCL company that has recently increased its price. Since July, the price hikes in the industry have come and gone. On July 10, Jiangyin Mingkang Insulating Glass Fiber Co., Ltd. announced that it will raise the ex-factory price of various specifications of CCL by 5 yuan each. Meizhou Weilibang Electronic Technology Co., Ltd. will also raise the ex-factory price of CCL for each specification by 5 yuan. In July, a number of other companies raised the ex-factory price of copper foil.
The following is the price of CCL found in Xiao Bian in Alibaba:
The industry believes that due to the high concentration of the CCL industry, pricing power is basically in the hands of Jianye, South Asia, Shengyi Technology (, diagnostic stocks), so in the case of shortage of important raw materials and price increases, CCL companies can be timely Conduct price transmission and take the opportunity to improve profitability. As the PCB industry enters the peak season, the demand for PCBs in many industries, including new energy vehicles and mobile phones, has achieved a double-digit annual growth rate, laying the foundation for the price increase of CCL. It is estimated that by 2020, there will be a global market demand for printed circuit board of 9 billion US dollars. The most influential CCL giants have once again raised their prices, meaning that the upstream and downstream supply chains will also be fully followed. From the trend of price increases of major CCL manufacturers last year, the price hike will continue. As China gradually enters the 5G era, consumer electronics faces a new round of development, which is bound to detonate the demand for larger CCL.
CCL faucet stocks inventory1. Ultrasonic Electronics: It has two major businesses: CCL and PCB.
2. Tongling Nonferrous: Benefiting from the price increase of copper foil.
3. Shengyi Technology: The main business is engaged in the manufacture and sales of CCL, and its sales scale ranks second in the world. It is also one of the most complete varieties of specifications in the global CCL industry.
4. Jinan Guoji: CCL products accounted for 98.44% of the main business income.
With the development of light, thin, small, high-density and multi-functional electronic products, the density and integration of components on printed boards are getting higher and higher, power consumption is getting larger and larger, and the heat dissipation requirements for PCB substrates are increasing. The more urgent, if the heat dissipation of the substrate is not good, the components on the printed circuit board will be overheated, which will reduce the reliability of the whole machine. In this context, a high heat dissipation metal PCB substrate was born.
The most widely used metal-based PCB substrate is an aluminum-based copper clad laminate. The product was invented by Japan's Sanyo National Policy in 1969 and was applied to the STK series of power amplifier hybrid integrated circuits in 1974. In the early 1980s, China's metal-based copper clad laminates were mainly used in military products. At that time, metal PCB substrate materials were completely dependent on imports and were expensive. In the mid-to-late 1980s, with the widespread use and dosage of aluminum-based copper clad laminates in automotive and motorcycle electronic products, the development of metal PCB substrate research and manufacturing technology in China and its fields in electronics, telecommunications, power, etc. Wide range of applications.
Representative foreign metal substrate manufacturers include Sumitomo, Japan Matsushita Electric Works, DENKA HITY PLATE, and American Begs. There are three series of Sumitomo Metal PCB substrates (ie, aluminum-based copper clad laminates, iron-based copper clad laminates, and silicon steel clad laminates). Aluminum-based copper clad laminates, iron-based copper clad laminates, and silicon steel clad laminates are sold under the trade names ALC-1401 and ALC-1370, ALC-5950 and ALC-3370 and ALC-2420, respectively. The earliest manufacturer of metal-based copper clad laminates in China was the state-owned 704th factory. In the late 1990s, many units in China also developed and produced aluminum-based copper clad laminates. The metal substrate of the 704 factory has three series, namely aluminum-based copper clad laminate, copper-based copper clad laminate, and iron-based copper clad laminate. The aluminum-based copper clad laminates of the 704 factory are divided into three types according to their characteristics: general-purpose and high-heat-dissipation type and high-frequency circuit. The commercial grades are MAF-01, MAF-02, MAF-03, copper substrate and iron substrate. The product grades are LSC-043F and MSF-034, respectively. According to estimates, the global metal-based PCB production value is about 2 billion US dollars, Japan's metal-based PCB production value was 2.5 billion yen in 1991, 6 billion yen in 1996, and increased to 8 billion yen in 2001, about 13% per year. The speed is increasing.
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