Overview:
All electronic products are shrinking as we are in the world. As circuit functions and integration increase, the space on the PCB board becomes precious. The main board space is allocated to the application's core functions, including microprocessors, FPGAs, ASICs, and the high-speed data channels and supporting components associated with them. Although the designer does not want to do this, the power supply must be compressed to the remaining limited space. As the function and density increase, the power consumption also increases accordingly. This poses a big challenge for power supply designers, how to provide higher power with smaller footprints?
The answer is simple: increase efficiency and increase switching frequency. In fact, this is a difficult problem to solve because higher efficiency and higher switching frequency are mutually exclusive. Despite this, IR's IR3847 high current point-of-load (POL) integrated voltage regulator designers have developed a DC-DC buck converter with integrated MOSFETs that can be packaged in a compact 5 x 6 mm package. Medium (Figure 1), the rated current of the IR third-generation SupIRBuck series is extended to 25A.
Figure 1: IR3847 5x6 mm QFN package.
This solution has led to joint innovation in three areas: IC packaging, IC switching regulator circuit design and high efficiency MOSFETs. Since the latest thermally enhanced package uses copper, the innovation in the controller is for the latest generation of controllers and IRs with switching frequencies greater than 1MHz, ie 12.5 MOSFETs, the IR3847 can be operated at 25A without a heat sink. Running down, the PCB size is reduced by 70% compared to discrete solutions with controllers and power MOSFETs. With the IR3847 (Figure 2), a complete 25A power solution is now available in a small area of ​​168mm2.
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