Compared with traditional light sources such as incandescent lamps and compact fluorescent lamps, light-emitting diodes ( LEDs ) have many advantages such as high luminous efficiency, long life, and high directivity, and are increasingly favored by the industry and used in the general lighting market. LED lighting applications should be accelerated. In the short term, problems from the cost, technology, and standards must be overcome. The technical aspects, including color temperature, color rendering, and efficiency improvement, still need further improvement. The application of LED in the general lighting market involves many requirements, such as LED light source, power conversion, drive control, heat dissipation and optics.
Thin film chip technology
At present, the key to the development of LED chip technology lies in substrate materials and wafer growth technology. Base Materials In addition to traditional sapphire materials, silicon (Si), silicon carbide (SiC), zinc oxide (ZnO) and gallium nitride (GaN) are also the focus of current research. Whether it's high-power chips for accent lighting and monolithic lighting, or low-power chips for decorative lighting and some simple auxiliary lighting, the key to technological advancement is around how to develop more efficient and stable chips. Therefore, improving the efficiency of LED chips has become the key to improving the overall technical indicators of LED lighting. In just a few years, with the improvement of a series of technologies such as chip structure, surface roughening and multi-quantum well structure design, LED has made a major breakthrough in luminous efficiency. The development of LED chip structure is shown in Figure 1. It is believed that as the technology continues to mature, LED quantum efficiency will be further improved, and the luminous efficiency of LED chips will also increase.
The development history of LED chip structure
Thin film technology (Thinfilm) is a key technology for producing ultra-bright LED chips, which can reduce lateral light loss. More than 97% of light can be output from the front through the bottom reflection surface, which not only greatly improves LED luminous efficiency, but also simple lens. design.
Comparison of the front light output ratio of ordinary LED and thin technology LED
High-power LED packaging technology can be divided into three categories: single chip, multi-chip integration and on-chip package. The following will be explained.
Luminous efficiency, heat dissipation, and reliability are advantages of a single chip package
Single chip package is the most widely used in packaging technology. The main technical bottleneck is chip yield, color temperature control and phosphor coating technology. Osram Opto Semiconductors' GoldenDRAGONPlusLED is packaged in a silicone package. Internal brief structure. The LED has a beam angle of 170 degrees and is ideally suited to secondary optical lenses or reflectors. Its silicone lens has high temperature resistance and low attenuation. The unique package design further enhances the heat dissipation performance of the LED, so that the thermal resistance of the product is controlled at about 6.5 ° C per watt, which helps to reduce the thermal resistance. In addition, the specific formulation of the phosphors allows the color temperature of the LED to cover the cool white, neutral white and warm white ranges. The advantages of a single-chip package are high light efficiency, easy heat dissipation, easy light distribution, and reliability.
LED chip technology and application design knowledge
Multi-chip integrated package for high luminous flux in a small volume
Multi-chip integrated components are the most common form of packaging for high-power LED components. They can be divided into low-power and high-power chip-integrated components. The former is the most typical one-watt high-power LED component with six low-power chips. The advantage of such components is the low cost, which is the main production route of many high-power components. The high-power chip is represented by the OSTARSMT series. By optimizing the design, the thermal resistance of the final product can be controlled at 3.1 °C per watt, while driving up to 15 watts of high power. The advantage of this package is that it achieves high luminous flux in a small space.
P02 Series Push Wire Connectors
Multi-pole push-in connector
Mono/dual press button for easy wiring and releasing
Compatible with earth tag and/or cable clamp
Fast Connection Wire Connector,14-20 awg Wire Connectors,Push Wire Connector 4 Pole,Push Wire Connector 2 Ways
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