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Infineon Technologies AG (FSE: IFX/OTCQX: IFNNY) has expanded its existing lineup of CoolMOS® technology products with the 600V CoolMOS® P7 and 600V CoolMOS® C7Gold (G7) series. These two product families feature breakdown voltages up to 600V for better super-junction MOSFET performance. They achieve very good power density in the target application.

600VCoolMOSP7: Optimized combination of high efficiency and ease of use

The new P7 sets the efficiency benchmark and has a higher price/performance ratio, which greatly simplifies the design. Target applications for the device include chargers, adapters, lighting, televisions, PC power supplies, solar power, servers, telecommunications, and electric vehicle charging, with power levels ranging from 100W to 15kW. In different topologies, the 600VCoolMOSP7 is able to increase the efficiency of the target application by 1.5%, and the operating temperature can be reduced by up to 4.2 °C compared to competing products.

The surface mount (SMD) and through-hole package models have on-resistance RDS(on) ranging from 37-600mΩ, so the 600VCoolMOSP7 is suitable for a wide range of applications with a wide power range. In addition, superior antistatic capability of over 2kV (HBM) protects the device from electrostatic discharge damage during production, effectively improving manufacturing quality. Finally, rugged body diodes protect the device during hard commutation events in LLC circuits.

600VCoolMOSC7Gold (G7): State-of-the-art FOM in an innovative leadless SMDTO package

The G7 features a low on-resistance RDS(on), minimal gate charge QG, reduced energy stored in the output capacitor, and a 4-pin Kelvin source capability in a leadless TO package. This minimizes losses in PFC and LLC circuits and increases performance by 0.6% while increasing the full load efficiency of the PFC circuit. The G7 has a very low source parasitic inductance of 1nH, which also helps improve efficiency.

The G7 is packaged in a leadless TO package for improved thermal performance for high current designs while the SMD process helps reduce installation costs. In addition, the 600VG7 has the industry's lowest on-resistance RDS(on) ranging from 28m to 150m. Compared to the traditional D2PAK package, the device's surface area, height and board space are reduced by 30%, 50% and 60%, respectively. All of these features make the device ideal for the highest efficiency and power density benchmarks in applications such as servers, telecommunications, industrial and solar.

Availability

The 600VCoolMOSP7 and 600V CoolMOSC7Gold series devices are in volume production and can be ordered. For more information, please visit: and