Cost-effective, unaffected performance, and future-proof innovation architecture, ready for DOCSIS® 3.1 initial market deployment
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STMicroelectronics (ST), the world's leading semiconductor supplier across multiple electronic applications, announced the DOCSIS 3.1 chipset for STiD325. The new product is suitable for broadband CPE cable modems, embedded multimedia terminal adapters (eMTAs) and data gateways. It can also be used for video gateways if connected to a set-top box chipset.
Developed by CableLabs®, the DOCSIS 3.1 uses OFDM multi-carrier modulation with Low Density Parity Forward Error Correction to improve spectral efficiency for existing fiber-optic coaxial cable hybrid networks (HFC, Hybrid Fiber-Coax opens the era of gigabit data transmission.
Philippe Notton, vice president and general manager of the Consumer Electronics Division of STMicroelectronics, said: "Our innovative platform architecture is well prepared for the first commercial deployment of DOCSIS 3.1, helping to make Barcelona (STiD325) a cable This goal of the TV industry reference product. As a stand-alone chipset for multi-gigabit cable gateways, or integrated with Monaco system chips for ultra-high definition (UltraHD) video media gateways, STMicroelectronics offers users a total solution To speed up application design."
Barcelona is fully compatible with the DOCSIS 3.1 specification, including:
· 2 OFDM 196 MHz downlink channels;
· 32 single-carrier DOCSIS 3.0 QAM downlink channels;
· 2 96 MHz OFDM-A upstream channels;
· 8 single-carrier DOCSIS 3.0 QAM upstream channels;
STMicroelectronics has a long history of developing DOCSIS technology, providing resources not only for DOCSIS standards development, but also for all acceptance testing and interactive testing programs. As the value of ST's participation in industry standardization, Barcelona's early platform was successfully launched in the world's first end-to-end DOCSIS 3.1 field test at the beginning of the year.
Designed to achieve superior performance at an affordable price, Barcelona offers a variety of powerful technical features:
· High performance, 64-bit ARM® multi-core CPU, processing speed higher than 10K DMIPS, each port can support line-rate networking, providing hardware acceleration for routers and switches to assist System Operators (MSOs) build future-oriented client platforms to reserve more space for enabling new services on the site;
· Downward compatibility with 32 x 8 DOCSIS 3.0 uplink and downlink channels, allowing users to smoothly upgrade to DOCSIS 3.1 at an affordable price;
· Flexible architecture that facilitates independent software development upgrades, minimizes coupling between protocols, introduces new features such as home security monitoring and home automation, and supports a variety of Wi-Fi configurations;
· The 28nm FD-SOI semiconductor manufacturing process delivers outstanding energy efficiency in a variety of operating conditions, including fanless design and high energy efficiency RF and analog circuit integration.
Samples of the Barcelona (STiD325) have been offered to major customers with built-in pre-integrated RDK-B software, including DOCSIS and Packet-Cable protocol stacks. For more information on STiD325 chipset products and technology, please contact your local STMicroelectronics office.
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