Dialog Semiconductor Co., Ltd. announced the launch of the world's first real-time processing chip for 2D / 3D image conversion: DA8223. This chip provides real-time conversion processing of 2D / 3D video images for various portable devices including smartphones and tablets Features. The device also integrates a parallax barrier (parallax barrier) screen driver, allowing users to watch 3D content without glasses.
The chip analyzes each frame of 2D video images and creates a layered depth map (Z-depth) by separating the foreground and background images. Therefore, each original image pixel is mapped to the left eye and the right eye, and when viewed through a display with a parallax barrier, a 3D image effect can be directly rendered. DA8223 integrates a complete 2D / 3D image conversion algorithm. Compared with traditional software-based solutions, the chip does not bring additional burden to the main application processor when 2D / 3D image conversion, and does not require external memory .
"At present, the demand for experiencing 3D image effects on smartphones has arrived, but there is currently very little 3D image content. By adopting DA8223, you can create a truly unique, immediate Users experience devices with unlimited 3D content, "said Mark Tyndall, vice president of corporate development and strategy at Dialog Semiconductor.
"DA8223 is the first hardware-based solution to 2D / 3D image conversion technology optimized for a variety of portable devices. It does not actually require software development, and is in line with the software implementation solution based on the application processor. Compared to it, its demand for batteries and computing power is minimal. "Mark added.
By supporting images and videos at 60 frames per second, the system can display 3D content in landscape and portrait formats in real time. DA8223 ensures a richer and more comfortable 3D viewing experience for actually 2D content, even in ultra Long time use.
The DA8223 is compatible with the most extensive 3D-capable displays, from 3.8-inch smartphones to 10-inch tablets. It can also work with any display device equipped with a parallax barrier (parallax barrier), including OLED and the latest TFT display from Sharp.
This 5x5mm size, 81-ball UFBGA package can be mounted on a printed circuit board between the application processor and the 3D display, or mounted on the display module using the COF process. Samples of the device will be available in early 2011 to ensure mass production of handheld products in the second half of 2011.
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