At present, the polarization pattern of the LED packaging industry has already formed, the larger one is Evergrande and the strong one is Hengqiang.
Liu Xiaoyan, director of marketing equipment for Cuitao Automation, said, “equipment manufacturers need to take responsibility for themselves, not only for quality, but also for service. This is the survival card for enterprises.â€
Long-term locking wire bonding machine perfect after-sales service system
Cui Tao exhibitors and robot "Afu" took a group photo in front of the booth
As we all know, Cui Tao, as a semiconductor and LED automation equipment manufacturer with 14 years of R&D experience, has long been known from the semiconductor soft-sealing IC market, LED-Dispaly market, LED-LAMP market, LED-SMD market and semiconductor hard-sealing IC market. Sand field, the product covers the whole process of solid crystal, wire bonding and dispensing.
"In the first half of this year, the entire LED industry continued the pattern of last year, continuing the larger Evergrande, and the companies that survived eventually had special technology or strong capital." Liu Xiaoyan, director of marketing equipment for Cuitao Automation, said.
According to the latest data from the High-tech Research Institute LED Research Institute (GGII), the LED packaging market in China was 8.8 billion US dollars in 2015, a year-on-year increase of 2%. It is estimated that the LED packaging market will reach US$9.3 billion in 2016, and the growth is expected to exceed 5%.
Cui Tao Marketing Director Liu Xiaoyan was interviewed by reporters
The domestic wire bonding machine has been launched since 2011 and 2012. After several years of technical accumulation, the stability of the machine is constantly improving, so now more and more customers are beginning to accept domestic wire bonding machine equipment.
"At present, the front part of the LED package is basically localized (the localization rate has reached more than 90%) except for the wire bonding machine. Therefore, for the wire bonding machine manufacturers, the market space is very large. It is expected that the wire machine sales will become in the next few years. Double growth." Cui Tao Liu Xiaoyan said.
It is worth mentioning that Cui Tao has almost no competitors in the industry in two areas, one is the IC soft seal market; the other is the LED-Display market. The main winning weapon is in addition to the cost performance of the machine itself, more importantly, the perfect after-sales service management.
According to Liu Xiaoyan, "A few years ago, we introduced a customer service online management system, customers have problems, a phone call, online response, after-sales engineers to the customer, solve problems, solve the problem, leave, etc. Can be seen online in time."
Based on the LED market, lock in the semiconductor IC market
Cui Tao's current research and development focus on wire bonding machines is also the most difficult area to overcome. It has been monopolized by foreign markets before, and solid crystal and dispensing machines are relatively simple.
Cui Tao began to invest in wire bonding machines (gold wire machines) in 2008. Just like in the past, he invested in solid crystal machines and dispensers. At first, he was looking for technical talents in China. In fact, in terms of technology, the domestic talent resources of wire bonding machines. Very lacking, so in 2012, Cui Tao established the Tsui Tao Singapore subsidiary to attract international talents and focus on the development of wire bonding machines.
Cui Tao Automation Singapore R&D Center
The reason why we chose to go to Singapore is to look at the entire industry, whether it is ASM or KS. The R&D centers of international wire bonding equipment manufacturers are located in Singapore, and ST, STATS ChipPAC, Micro and other international top semiconductor factories also set up factories in Singapore. It lays a foundation for Cui Tao's grasp of cutting-edge technology in the field of wire bonding machines and the accumulation of talents.
For the manufacturers of equipment, the growth of equipment mainly depends on the terminal market of a market. If the demand of the terminal market increases, the packaging factory may increase the equipment. On the contrary, if the terminal market does not increase, it may have little impact on the packaging enterprise, but The impact on the equipment factory will be great. Therefore, manufacturers of equipment must constantly target different markets.
At present, the localization rate of LED wire bonding machines in the market is low, so there is still a chance, but Cui Tao has now begun to lay out the semiconductor IC market, which also coincides with the national integrated circuit related policies!
The new "PHOTON Fu" has received much attention
Cui Tao exhibited a new generation of wire bonding machine--"PHOTON Fu" wire bonding machine
Recently, Cui Tao's key product “PHOTON Fu†(the fifth generation product) was born based on the potential needs of customers:
First, reduce the cost: the width of the bracket is made wider and wider, and the Y stroke of the wire bonding machine is increased from 60mm to 72mm according to the requirements of the wide bracket;
Second, improve the brightness: the effective welding wire area of ​​the chip is made smaller, the effective light-emitting area becomes larger, thereby improving the brightness of the product, and the wire bonding machine can weld the electrode 45 μm;
Third, on the basis of the above two, the speed of “PHOTON Fu†is 20% higher than that of the 800B series.
Liu Xiaoyan revealed that “in response to the trend, we will develop equipment for adapting to smaller electrodes and wider brackets in the future.â€
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