I. Overview
Traditional thermal materials are mostly metals and metal oxides, as well as other non-metallic materials such as graphite, carbon black, A1N, SiC, and the like. With the development of science and technology and production, many products put forward higher requirements for thermal conductive materials, and hope that they have better comprehensive performance, light weight, strong chemical resistance, excellent electrical insulation, impact resistance, easy processing and so on. . Thermally conductive and insulating polymer composites are widely used due to their excellent comprehensive properties.
However, since the polymer material is mostly a poor conductor of heat, it limits its application in heat conduction. Therefore, the development of a new polymer material with good thermal conductivity has become an important development direction of the current heat conductive material. Especially in recent years, with the rapid development of high-power electronic and electrical products, there will inevitably be more and more problems due to product heating, resulting in reduced product efficacy and shortened service life. According to the data, the reliability of electronic components decreases by 10% for every 2 °C increase; the lifetime at 50 °C is only 1/6 of that at 25 °C.
Thermally conductive fillers are mainly divided into two types: one is a thermally conductive insulating filler, such as a metal oxide filler, a metal nitride filler, and the like. The other is a thermally conductive non-insulating filler such as a carbon-based filler and various metal fillers. The former is mainly used for occasions where electronic insulation components have high requirements for electrical insulation properties, while the latter is mainly used for heat exchangers of chemical equipment and other places where electrical insulation performance is low. The type, size and distribution of the filler, the amount of filler and the interfacial properties between the filler and the matrix have an effect on the thermal conductivity of the composite.
The base polymers used for heat conductive plastics are: PA (nylon), FEP (perfluoropolypropylene), PPS, PP, PI epoxy, POM, PS and PS and PE composites.
Research status of polymer-based thermal conductive composites at home and abroad: Polymer-based thermal conductive composites improve the thermal conductivity of polymer materials by adding thermally conductive fillers. Generally, it is based on high molecular weight polymers (such as polyolefin, epoxy resin, polyimide, polytetrafluoroethylene, etc.), and metal oxides with good thermal conductivity such as A1203, MgO, and metals with good thermal conductivity and insulation properties. Nitrides AIN, BN, and high thermal conductivity metal materials such as Cu, AI, etc. are thermally conductive fillers, which are combined in a two-phase or multi-phase system. At present, companies in Europe, Japan and the United States have reported that mature products are being used. For example, the Royal DSM Group of Engineering Plastics has introduced the first new polymer since the 21st century: Stanyl® TC series of thermally conductive plastics for LEDs ; becoming the world's leading supplier of plastic thermal management solutions for LED lighting applications. American Advanced Ceramics and EPIC have developed BN/Polybutylene (PB) composite engineering plastics with a thermal conductivity of 20.35W/(m?K), which can be prepared by common processes such as compression molding, and can be mainly used for electronic packaging. Integrated circuit boards, electronic control components, computer housings, and the like.
The effect of AIN content, particle size, silane coupling agent and processing technology on the thermal conductivity of the system was prepared by molding method. Studies have shown that with the increase of A1N content and particle size, the thermal conductivity of the system is continuously improved; the addition of coupling agent enhances the interfacial adhesion between AIN and epoxy resin, and reduces the thermal resistance between interfaces, which is beneficial to The thermal conductivity of the system is improved. When the AIN particle size was 5.3 μm and the content was 67 v01%, the thermal conductivity of the AIN/EP thermally conductive composite was 14 W/(m·K).
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